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- 1 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triu ne systems, llc TS32101 version 2.0 description features ? output up to 1 .5 a at 5.0v with 1.8 v input ? wide input voltage range: 1.75v C 5.0v ? output current up to 2a ? robust operation during hot - load disconnect and hot - load disable ? adjustable output voltage up to 5 .5 v ? adj ustable output current limit ? includes full output isolation/reverse current blocking when disabled ? 2 mhz 10% fixed switching frequency ? l ow power m ode ? high e fficiency C up to 95 % ? full p rotection for over - current, over - temperature , v out over - voltage, and v in under - voltage ? power good/f ault indication summary specifications ? ambient operating temperature - 40c to 85c ? packaged in a 16pin qfn (3x3) typical application the TS32101 is a dc/dc synchronous switching boost converter with fully integrated power switches, internal pwm current m ode compensation, and full fault protection. the switching frequency of 2 mhz was chosen to enable the use of small external components for portable applications. the device also has a constant output current limit loop to provide a sharp output current l imit that doesnt move significantly with input voltage and output voltage. applications ? usb p ower ? portable products ? wireless remote sensors ? emergency c hargers ? battery - powered chargers for portable equipment ? compa tible with ni - mh, ni - cd, li - ion alkaline s ources high efficiency dc/dc boost converter for usb, 2mhz g n d e n v o u t p g p g n d c o u t l o u t v i n r p u l l u p ( o p t i o n a l ) v d d c i n v s w v o u t 2 1 u h 2 x 2 2 u f f b t s 3 2 1 0 1 c f f r t o p r b o t r s e n s e i s e n c o u t 2
- 2 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 pinout pin descri ption pin symbol pin # function description vout 1 output voltage connects to main output capacitor. internally shorted to pins 2 and 16 vout 2 output voltage connects to main output capacitor. internally shorted to pins 1 and 16 vout 3 output volt age connects to main output capacitor and is utilized for output current sensing. isen 4 output current sense feedback provides output current sensing fb 5 output voltage feedback feedback point for output voltage gnd 6 gnd primary ground for the majori ty of the device except the low - side power fet. en 7 enable input tie en pin high to enable device. pg 8 pg output open - drain output for power good. n/c 9 not used connect to gnd n/c 10 not used connect to gnd vin 11 input voltage connect to input sup ply and input capacitor. vsw 12 switching voltage node connected to 1.0uh (typical) inductor pgnd 13 power gnd gnd supply for internal low - side fet vsw 14 switching voltage node connected to 1.0uh (typical) inductor pgnd 15 power gnd gnd supply for int ernal low - side fet vout 16 output voltage connects to main output capacitor. internally shorted to pins 1 and 2 ts321 01 t s 3 2 1 0 1 v o u t v o u t i s e n v o u t v i n n c n c v s w v s w p g n d v o u t p g n d e n g n d f b p g
- 3 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 functional block dia gram figure 1: ts 32 1 01 block diagram c u r r e n t l i m i t g a t e d r i v e g a t e d r i v e g a t e d r i v e c o n t r o l v o u t v s w o s c i l l a t o r r a m p g e n e r a t o r c o m p a r a t o r e r r o r a m p g n d m o n i t o r & c o n t r o l v i n u n d e r v o l t a g e p r o t e c t i o n v o u t v i n v i n ? e n p g n d p g c o u t l o u t c o m p e n s a t i o n n e t w o r k 1 . 8 C 3 . 5 v v r e f c i n v i n v o u t u n d e r v o l t a g e d e t e c t i o n b u l k c o n t r o l f b c f f r t o p r b o t c o u t 2 v o u t 2 i s e n r s e n s e s u m m i n g a m p l i f i e r
- 4 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 absolute maximum rat ings over operating free C air temperature range unless otherwise noted (1,2) unit vin - 0.3 to 5. 0 v en , pg , fb - 0.3 to 5.5 v v sw - 1 to 6.0 v vout , isen - 0.3 to 6.0 v continuous total power dissipation see dissipation rating table electrostatic discharge C human body mo del 2k v electrostatic discharge C charged device model +/ - 500 v lead temperature (soldering, 10 seconds) 260 ? c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress rati ngs only a nd functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is n ot implied. exposure to absolute C maximum C rated conditions for extended periods may affect device reliability. (2) al l voltage values are with respect to network ground terminal. thermal characterist ics symbol parameter value unit ? ja thermal resistance junction to air (note 1) 50 c/w t stg storage temperature range - 65 to 150 c t j operating ambient temperature ra nge - 40 to 85 c t j max maximum junction temperature 150 c t j operating junction temperature range - 40 to 125 c note 1: assumes tq fn - 1 6 in 1 in 2 area of 2 oz copper and 25 ? c ambient temperature. recommended operatin g conditions symbol parameter min typ max unit vin input operating voltage 1.8 2.4 5. 5 v l out output filter inductor typical value (note 1) 1.0 uh c out output filter capacitor typical value (note 2) 33 47 100 uf c out 2 vout2 filter capacitor typical value (note 2) 0.1 1 uf c bypass input supply bypass capacitor typical value (note 3) 8 10 uf r top feedback divider resistor typical value (note 4) 1000 k r bot feedback divider resistor typical value (note 4) 330 k note 1: for best performance, an inductor with a saturation cu rrent rating higher than the maximum input current requirement plus the inductor current ripple. see inductor selection section to determine input current and ripple current. note 2: for best performance, a low esr ceramic capacitor should be used . note 3 : for best performance, a low esr ceramic capacitor should be used. if c bypass is not a low esr ceramic capacitor, a 0.1uf ceramic capacitor should be added in parallel to c bypass . note 4: values shown for 5v output.
- 5 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 characteristics electrical characte ristics, t a = - 40c to 85 c, vin = 2.4 v (unless otherwise noted) symbol parameter condition min typ max unit vin supply voltage v in voltage input 1.75 5.0 v i in - stby quiescent current standby mode en = low, vout=0v 5 10 ua i in - lpm operating low power mode input current iout = 0 ua 5 0 ua v out supply current i out quiescent current normal mode (note 1) en = high , switching 3 ma en = high , non - switching 500 ua i out - stby quiescent current, stby en = low , vout=5v 25 ua i out output current en = high, v in > 0.7 * vout 2 a vin under voltage lockout (uvlo) v in_uv vin under voltage detect threshold increasing vin 1.5 v v in - uv_hyst vin under voltage detect hysteresis 1 50 mv osc f osc oscillator frequency 1.8 2 2.2 mhz pg open drain output v pg_thresh power good voltage detect threshold vout increasing 90 % v out v pg_ hyst power good voltage detect hysteresis 1 % v out i oh - pg high - level output leakage v pg = 5.0 v 0.1 ua v ol - pg low - level output voltage i pg = - 1ma 0.4 v en inp ut v ih high level input voltage 1.5 v v il low level input voltage 0.6 v v hyst input hysteresis 150 mv i in - en input leakage v en =vin 0.1 ua v en =0v 0.1 ua thermal shutdown tsd thermal shutdown junction temperature 150 170 c tsd hyst tsd hysteresis 10 c note 1: large percentage of supply current due to power fet gate switching losses.
- 6 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 boost converter char acteristics electrical characteristics, t a = - 40c to 85 c, vin = 2.4 v, vout = 5.0v (unless otherwise noted) symbol parameter condition min typ max unit boost regulator: l=1.0 uh and c=44 uf v out output voltage 3.0 5. 5 v v fb feedback voltage 1.175 1.2 1.225 v r dson high side switch on resistance i sw = - 1a, t j =25c 1 2 0 m? sw = 1a, t j =25c 50 m? ocd over current detect ls switch current 3 a v isen output current threshold voltage 23 mv v out - ov v out over voltage threshold 101 102 103 %v out duty max max duty cycle 85 % functional descripti on the ts 32101 is a fully - integrat ed, low - voltage synchronous boost converter ic based on a highly - efficient switching topology. it is optimized to be powered from nimh or li - ion batteries and includes features to make it suitable for powering portab le equipment as an emergency power/charg ing source. a 2 mhz internal switching frequency yields a good balance between efficiency and the ability to use small, lo w - cost lc filter components. internal protection details internal current limit the current through the low side switch is sensed on a cycle by cycle basis and if current limit is reached, it will abbreviate the cycle. current limit is always active when the boost converter is enabled. adjustable output current limit the TS32101 has an adjustable output current limit that is impl emented by sensing the voltage across an external resistor placed in series with the output. the voltage across this resistor is continuously monitored with no output current limit occurring until the output current is large enough to produce a voltage dr op of 23mv across the sense resistor. if the voltage drop across the sense resistor reaches 23mv the TS32101 will reduce the duty cycle to limit the output current and result in a constant output current limit. this feature can be disabled by connecting the isen to vout and removal of the sense resistor. adjustable output voltage the TS32101 has an adjustable output voltage selected by an external resistor divider in the feedback loop. to change the output voltage, replace resistors r top and r bot with values from the following equation: vout = 1.2 * (1 + r top / r bot ) power good the pg signal provides the ability to monitor fault conditions and power supply sequencing. the pg output is valid high when the TS32101 is enabled, the input voltage is ab ove the vin under - voltage threshold, the output voltage is above 90% of the desired value, and the device is not in thermal shutdown. the pg output can be utilized for power supply sequencing. when the device is operating normally and the output voltage is above 90% of the desired value, the pg output will be high. a 100us deglitch timer is used to insure that the pg signal does not respond to noise or transients. thermal shutdown if the temperature of the die exceeds 1 5 0c (typical), the v sw outputs wil l tri - state to protect the device from damage. the pg and all other protection circuitry will stay active to inform the system of the failure mode. once the device cools to 140 c (typical), the device will attempt to start up again. if the device reach es 1 5 0c, the shutdown /restart sequence will repeat. the pg output will be pulled low in this condition.
- 7 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 output over voltage protection the ts 32101 has an output over voltage protection circuit which prevents the device from reaching a dangerously high voltage under sudden light load conditions. the typical overvoltage detection threshold is 102% of vout. output voltage disable when the enable pin of the ts 32101 is low, not only is switching disabled, but the output is isolated from the input . this func tionality is maintained whether the output node is at a higher or a lower potential th an the input voltage. low power mode when the output current is low the ts 32101 will detect and automatically enter low power mode. in low power mode, switching stops w hen the output is slightly above the regulation point and the device enters a sleep state. the sleep state continues until the output drops slightly below the regulation point. at this point, switching will resume and if the load c urrent is increased eno ugh to prevent the output from going above the regulation point, low power mode is exited. external components the internal co mpensation is optimized for a 4 7uf output capacitor and a 1.0 uh inductor. to keep the output ripple low, a low esr (less than 35mohm) ceramic capacitor is recommended.
- 8 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 package mechanical d rawings ( all dimensions in mm ) units millimeters dimensions limits min nom max number of pins n 16 pitch e 0.50 bsc overall height a 0.80 0.90 1.00 sta ndoff a1 0.00 0.02 0.05 contact thickness a3 0.20 ref overall length d 3.00 bsc exposed pad width e2 1.55 1.70 1.80 overall width e 3.00 bsc exposed pad length d2 1.55 1.70 1.80 contact width b 0.20 0.25 0.30 contact length l 0.20 0.30 0.40 contact - to - exposed pad k 0.20 - - top view bottom view exposed pad
- 9 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 recommeded pcb land pattern dimensions in millimeters units millimeters dimension limits min nom max contact pitch e 0.50 bsc optional center pad width w2 - - 1.70 optional center pad length t2 - - 1.70 contact pad spacing c1 - 3.00 - contact pad spacing c2 - 3.00 - contact pad width (x16) x1 - - 0.35 contact pad length (x16) y1 - - 0.65 distance between pads g 0.15 - - notes: dimensions and tolerances per asme y14.5m . bsc: basic dimension. theoreti cally exact value s shown without tolerances. ref: refer e nce dimension, usually without tolerance, for information only. pacakging informatio n pb - free (rohs): the ts30011/12/13 devices are fully compliant for all materials covered by european union dire ctive 2002/95/ec, and meet all ipc - 1752 level 3 materials declaration requirements. msl, peak temp: the ts30011/12/13 family has a moisture sensitivity level (msl) 1 rating per jedec j - std - 020d. these devices also have a peak profile solder temperature (tp) of 260c. recommended land pattern silk screen
- 10 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 application using a multi - layer pcb to maximize the efficiency of this package for application on a single layer or multi - layer pcb, certain guidelines must be followed when laying out this part on the pcb. the following are guidelines for mounting the exposed pad ic on a multi - layer pcb with ground a plane . jedec standard fr4 pcb cross - section : multi - layer board (cross - sectional view) in a multi - layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. the efficiency of this method depends on several factors, including die area, number of thermal v ias, thickness of copper, etc. package thermal pad solder pad (land pattern) thermal via's package outline package and pcb land configuration for a multi-layer pcb ( square ) package solder pad package solder pad ( bottom trace ) thermal via component traces thermal isolation power plane only 1 . 5748 mm 0 . 0 - 0 . 071 mm board base & bottom pad 0 . 5246 - 0 . 5606 mm power plane ( 1 oz cu ) 1 . 0142 - 1 . 0502 mm ground plane ( 1 oz cu ) 1 . 5038 - 1 . 5748 mm component trace ( 2 oz cu ) 2 plane 4 plane
- 11 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 the above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. each application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the power in the system. the output current rating for the linear regulators may have to be de - rated for ambient temperatures above 85c. the de - rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. application using a single layer pcb layout recommendations for a single layer pcb: utilize as much copper area for power management. in a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). in both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. important: if the attachment method is not implemented correctly, the functionality of the produ ct is not guaranteed. power dissipation capability will be adversely affected if the device is incorrectly mounted onto the circuit board. mold compound die epoxy die attach exposed pad solder thermal vias with cu plating single layer , 2 oz cu ground layer , 1 oz cu signal layer , 1 oz cu bottom layer , 2 oz cu 20 % cu coverage 90 % cu coverage 5 % - 10 % cu coverage note : not to scale use as much copper area as possible for heat spread package thermal pad package outline
- 12 - specifications subject to change www.triunesystems.com copyright ? 201 2 , triune systems, llc TS32101 version 2.0 legal notices information contained in this publication regarding device applications and the like is provided on ly for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. typical parameters whic h may be provided in triune systems data sheets and/or specifications can and do v ary in different applications and actual performance may vary over time. all operating parameters, including typicals must be validated for your application by your technical experts. triune systems makes no representations or warranties of any kind wh ether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose. triune systems disclaims all liability arising from thi s information and its use. triune system products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other applicatio n in which the failure of the triune systems product could create a situation where personal injury or death may occur. should the buyer purchase or use triune systems products for any such unintended or unauthorized application, the buyer shall indemnify and hold triune systems, and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that triune systems was negligent regarding the design or manufacture of the part. no licenses are conveyed, implicitly or otherwise, under any triune systems intellect ual property rights. trademarks the triune systems? name and logo, mppt - lite?, and nanosmart? are trademarks of triune systems, llc. in the u.s.a.. all other trademarks mentioned herein are property of their respective companies. ? 2012 triune systems, llc. all rights reserved.

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